China claims world's smallest 3-axis accelerometer
By: Peter Clarke | electronics-eetimes | Posted: 07 Jan 2015, 08:37
A fabless chip company and foundry partnership from China claims to have designed and manufactured the world's smallest 3-axis MEMS accelerometer with a package size of 1.075mm by 1.075mm by 0.60mm.
[IMG]
The developer is MEMSensing Microsystems Co. Ltd. (Suzhou, China), which teamed up with Semiconductor Manufacturing International Corp. (SMIC) headquartered in Shanghai, to produce the MSA330.
The MSA330 has a 30 percent smaller footprint and 70 percent reduction in volume compared with competitors' best commercial products, MEMSensing said.
The package contains 3-axis MEMS device and CMOS ASIC to signal condition the output from the MEMS and uses through-silicon-vias (TSVs) and wafer-scale packaging to minimize the package volume, MEMSensing said.
The accelerometer is also the thinnest of its kind, measuring 0.5mm after surface mounting and 0.6mm in total height including 0.2mm solder balls.
"MEMSensing is SMIC's first domestic MEMS customer, and also one of its earliest customers worldwide which can be dated back to as early as 2009. MSA330 is the world's first MEMS accelerometer enabled by WLCSP (wafer-level chip-scale packaging), which is based on WLP and TSV technology. This approach belongs to the latest generation for MEMS accelerometer fabrication while other competitors are still lagging one step behind," said Li Gang, CEO of MEMSensing, in a statement. "The success for MSA330 product development proves that MEMSensing has now broadened its MEMS sensor product portfolio beyond the existing MEMS microphone and pressure sensors. We plan to allocate more resources to cooperate with SMIC to develop other advanced products and make an effort to further enrich China's domestic MEMS industry chain." he added.
Shiuh-Wuu Lee, executive vice president of technology development of SMIC, said the manufacturing of MEMS components with TSV-based wafer level packaging technologies is expected to enter commercial production in 2015.
MEMSensing was founded in 2007 and has established microphone and pressure sensor product lines.
อุตไฮเทคจีนเติบโตอย่างต่อเนื่อง
By: Peter Clarke | electronics-eetimes | Posted: 07 Jan 2015, 08:37
A fabless chip company and foundry partnership from China claims to have designed and manufactured the world's smallest 3-axis MEMS accelerometer with a package size of 1.075mm by 1.075mm by 0.60mm.
[IMG]
The developer is MEMSensing Microsystems Co. Ltd. (Suzhou, China), which teamed up with Semiconductor Manufacturing International Corp. (SMIC) headquartered in Shanghai, to produce the MSA330.
The MSA330 has a 30 percent smaller footprint and 70 percent reduction in volume compared with competitors' best commercial products, MEMSensing said.
The package contains 3-axis MEMS device and CMOS ASIC to signal condition the output from the MEMS and uses through-silicon-vias (TSVs) and wafer-scale packaging to minimize the package volume, MEMSensing said.
The accelerometer is also the thinnest of its kind, measuring 0.5mm after surface mounting and 0.6mm in total height including 0.2mm solder balls.
"MEMSensing is SMIC's first domestic MEMS customer, and also one of its earliest customers worldwide which can be dated back to as early as 2009. MSA330 is the world's first MEMS accelerometer enabled by WLCSP (wafer-level chip-scale packaging), which is based on WLP and TSV technology. This approach belongs to the latest generation for MEMS accelerometer fabrication while other competitors are still lagging one step behind," said Li Gang, CEO of MEMSensing, in a statement. "The success for MSA330 product development proves that MEMSensing has now broadened its MEMS sensor product portfolio beyond the existing MEMS microphone and pressure sensors. We plan to allocate more resources to cooperate with SMIC to develop other advanced products and make an effort to further enrich China's domestic MEMS industry chain." he added.
Shiuh-Wuu Lee, executive vice president of technology development of SMIC, said the manufacturing of MEMS components with TSV-based wafer level packaging technologies is expected to enter commercial production in 2015.
MEMSensing was founded in 2007 and has established microphone and pressure sensor product lines.